4. Electricity: measuring and testing
  5. Impedance, admittance or other quantities representative of...
  6. Distributive type parameters

Gnanalingam Arjavalingam

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Method for fabricating multi-layer thin film structure having a

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Methods for the measurement of the frequency dependent complex p

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Distributive type parameters
Patent

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Multi-layer thin film structure and parallel processing method f

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Profile ID: LFUS-PAI-P-1099197

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