Method for fabricating MOS transistors

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S217000, C438S223000, C438S227000, C438S231000, C438S291000, C438S298000, C438S305000, C438S585000, C438S595000, C438S740000, C438S751000, C438S756000, C438S757000

Reexamination Certificate

active

06852599

ABSTRACT:
A method for fabricating a metal oxide semiconductor (MOS) transistor, which can reduce the junction capacitance without degradation of transistor characteristics including forming a buffer oxide layer on a semiconductor substrate; successively conducting ion implantations for well formation and field stop formation in the substrate through the buffer oxide layer; removing the buffer oxide layer; forming and patterning a sacrificial layer to form a trench successively conducting ion implantations for threshold voltage adjustment and punch stop formation on the semiconductor substrate area exposed by the trench; forming a gate oxide layer on the exposed surface of the substrate; forming a polysilicon layer so as to completely fill the trench; polishing the polysilicon layer to form a gate electrode; removing the sacrificial layer; forming an LDD region in the substrate; forming spacers on side walls of the gate electrode; and forming source/drain regions.

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