Method for fabricating metal gate structures

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S316000, C257S382000, C257SE29300

Reexamination Certificate

active

07439571

ABSTRACT:
Methods of forming a microelectronic structure are described. Those methods comprise providing a substrate comprising source/drain and gate regions, wherein the gate region comprises a metal layer disposed on a gate dielectric layer, and then laser annealing the substrate.

REFERENCES:
patent: 5627427 (1997-05-01), Das et al.
patent: 6040224 (2000-03-01), Tsukamoto
patent: 6310367 (2001-10-01), Yagishita et al.
patent: 6495437 (2002-12-01), Yu
patent: 6599819 (2003-07-01), Goto
patent: 6653698 (2003-11-01), Lee et al.
patent: 6783591 (2004-08-01), Halliyal et al.
patent: 6794234 (2004-09-01), Polishchuk et al.
patent: 6890807 (2005-05-01), Chau et al.
patent: 7005365 (2006-02-01), Chambers
patent: 7015534 (2006-03-01), Colombo
patent: 2002/0105033 (2002-08-01), Zhang
patent: 2004/0126977 (2004-07-01), Bustos et al.
Pending U.S. Appl. No. 10/748,345, filed Dec. 29, 2003; inventor: Doczy Office Action dated Nov. 30, 2006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating metal gate structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating metal gate structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating metal gate structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3997519

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.