Method for fabricating fine pattern in semiconductor device

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...

Reexamination Certificate

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C216S072000, C216S079000, C438S725000

Reexamination Certificate

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07494599

ABSTRACT:
A method for forming a fine pattern in a semiconductor device includes forming a first polymer layer over an etch target layer, the first polymer layer including a carbon-rich polymer layer, forming a second polymer layer over the first polymer layer, the second polymer layer including a silicon-rich polymer layer, patterning the second polymer layer, oxidizing surfaces of the patterned second polymer layer, etching the first polymer layer using the patterned second polymer layer comprising the oxidized surfaces, and etching the etch target layer using the patterned second polymer layer comprising the oxidized surfaces and the etched first polymer layer.

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patent: 2006/0068592 (2006-03-01), Dostalik
patent: 10-2005-0058916 (2005-06-01), None
patent: 10-2006-0019668 (2006-03-01), None

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