Method for fabricating capacitor of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S239000, C438S243000, C438S386000, C438S387000

Reexamination Certificate

active

07129131

ABSTRACT:
A method for fabricating a capacitor of a semiconductor device. The semiconductor device includes: a bit line structure formed on a substrate and including stacked layers of a bit line, a hard mask and a spacer. The spacer is formed along a profile containing the bit line and the hard mask. A first inter-layer insulation layer is deposited on an entire surface of the bit line structure. A storage node contact plug is formed on the substrate by passing through the inter-layer insulation layer and having a partially etched portion. A second inter-layer insulation layer is formed on a partial portion of the first inter-layer insulation layer and the storage node contact plug. A lower electrode having a circular shape is formed on lateral sides of the second inter-layer insulation layer, an exposed portion of the first inter-layer insulation layer and the partially etched portion of the storage node contact plug, wherein the lower electrode electrically contacts at least a predetermined lateral side of the partially etched portion.

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patent: 5759892 (1998-06-01), Wang
patent: 5981377 (1999-11-01), Koyama
patent: 6015733 (2000-01-01), Lee et al.
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patent: 6528411 (2003-03-01), Kakuhara
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patent: 9-306989 (1997-11-01), None
patent: 10-163124 (1998-06-01), None
patent: 2001-210803 (2001-08-01), None

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