Method for fabricating capacitor in semiconductor memory device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Reexamination Certificate

active

07037778

ABSTRACT:
Disclosed is a method for fabricating a capacitor in a semiconductor memory device. The method includes the steps of: sequentially forming a first insulation layer and a first etch stop layer on a substrate; forming a plurality of contact holes by etching the first insulation layer and the first etch stop layer; forming a plurality of contact plugs on the plurality of contact holes such that the contact plugs are more projected than the first etch stop layer; sequentially forming a second etch stop layer and a capacitor insulation layer; forming a plurality of openings by etching the second etch stop layer and the capacitor insulation layer to expose the contact plugs; sequentially forming a storage node material and a sacrificial layer; etching the storage node material and the sacrificial layer, thereby obtaining isolated storage node material; and removing remaining portions of the sacrificial layer and the capacitor insulation layer.

REFERENCES:
patent: 6667209 (2003-12-01), Won et al.
patent: 6716679 (2004-04-01), Bae
patent: 6800522 (2004-10-01), Lee

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