Method for fabricating capacitor in semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S243000, C257SE21008

Reexamination Certificate

active

07547598

ABSTRACT:
A method for fabricating a capacitor in a semiconductor device includes forming a first insulation layer over a substrate, forming storage node contact plugs in the first insulation layer, contacting predetermined portions of the substrate, forming a second insulation layer over the first insulation layer and the storage node contact plugs, forming trenches exposing the storage node contact plugs, forming storage nodes in the trenches, forming a plasma barrier layer over the second insulation layer and the storage nodes, forming a capping layer over the plasma barrier layer and filled in the trenches, removing the capping layer, the plasma barrier layer, and the second insulation layer, forming a dielectric layer over the storage nodes, and forming a plate electrode over the dielectric layer.

REFERENCES:
patent: 5362526 (1994-11-01), Wang et al.
patent: 6051508 (2000-04-01), Takase et al.
patent: 6114198 (2000-09-01), Huang et al.
patent: 6238968 (2001-05-01), Yu et al.
patent: 6258691 (2001-07-01), Kim
patent: 6259127 (2001-07-01), Pan
patent: 6436786 (2002-08-01), Tsuzumitani et al.
patent: 6465351 (2002-10-01), Jeong
patent: 6884692 (2005-04-01), Rhodes et al.
patent: 2001/0044179 (2001-11-01), Kim
patent: 2002/0092657 (2002-07-01), Cook et al.
patent: 2004/0256652 (2004-12-01), Zheng
patent: 2005/0124149 (2005-06-01), Kim et al.
patent: 2006/0032833 (2006-02-01), Kawaguchi et al.
patent: 2006/0141788 (2006-06-01), Yoon
patent: 2006/0183297 (2006-08-01), Mun et al.
patent: 2007/0004218 (2007-01-01), Lee et al.
patent: 2007/0031999 (2007-02-01), Ho et al.
patent: 2007/0045769 (2007-03-01), Bian et al.
patent: 10-2000-0045311 (2000-07-01), None
patent: 10-2005-0032435 (2005-04-01), None
Notice of Preliminary Rejection from the Korean Intellectual Property Office, mailed Jun. 18, 2007 in Korean Patent Application No. 2006-0068467 and English translation thereof.
English language translation of the first Office Action issued from the State Intellectual Property Office of the People's Republic of China on Jul. 11, 2008, in counterpart Chinese Application No. 2006101541151.

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