Method for fabricating an ESD protection apparatus for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S200000, C438S202000, C257S355000

Reexamination Certificate

active

07629210

ABSTRACT:
To make electric current concentration and electric field concentration hardly take place in junction parts even in case of performing miniaturization and to achieve triggering at low voltage. An ESD protection apparatus is installed between an input terminal6of a semiconductor integrated circuit chip and a CMOS transistor100and includes a trigger element310comprising diodes311, 312which are broken down by overvoltage applied to the input terminal6and an ESD protection element210including longitudinal bipolar transistors211, 212for discharging the accumulated electric charge of the input terminal6by being electrically communicated owing to the breakdown of the diodes311, 312.

REFERENCES:
patent: 5043782 (1991-08-01), Avery
patent: 5272371 (1993-12-01), Bishop et al.
patent: 5276582 (1994-01-01), Merrill et al.
patent: 5471082 (1995-11-01), Maeda
patent: 5539327 (1996-07-01), Shigehara et al.
patent: 5623387 (1997-04-01), Li et al.
patent: 5648676 (1997-07-01), Iwai et al.
patent: 5774318 (1998-06-01), McClure et al.
patent: 5821797 (1998-10-01), Kinugasa et al.
patent: 5976921 (1999-11-01), Maeda
patent: 7294542 (2007-11-01), Okushima
patent: 61-232657 (1986-10-01), None
patent: 61-251165 (1986-11-01), None
patent: 62-242354 (1987-10-01), None
patent: 02-199868 (1990-08-01), None
patent: 02-244752 (1990-09-01), None
patent: 05-259394 (1993-10-01), None
patent: 06-163841 (1994-06-01), None
patent: 06-335162 (1994-12-01), None
patent: 09-213891 (1997-08-01), None
patent: 10-242400 (1998-09-01), None
patent: 11-168183 (1999-06-01), None
patent: 11-251533 (1999-09-01), None
patent: 1996-0014444 (1996-10-01), None
patent: 1999-30302 (1999-04-01), None
Adel S. Sedra, Kenneth C. Smith, Microelectronic Circuits, Holt, Rinehart and Winston, 1987, pp. 408-410.
Avalanche Injection and Second Breakdown in Transistors, P. Hower et al. IEEE Transactions on Electron Devices, vol. Ed-17, No. 4, Apr. 1970.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating an ESD protection apparatus for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating an ESD protection apparatus for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating an ESD protection apparatus for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4089017

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.