Method for fabricating a trench capacitor with an insulation...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S301000, C257S304000, C257SE27093, C257SE21653

Reexamination Certificate

active

11205323

ABSTRACT:
The present invention provides a method for fabricating a trench capacitor with an insulation collar in a substrate, which is electrically connected to the substrate on one side via a buried contact, in particular for a semiconductor memory cell with a planar selection transistor that is provided in the substrate and connected via the buried contact The invention likewise provides a corresponding trench capacitor.

REFERENCES:
patent: 5942799 (1999-08-01), Danek et al.
patent: 6259129 (2001-07-01), Gambino et al.
patent: 6548850 (2003-04-01), Gernhard et al.
patent: 6828192 (2004-12-01), Gustin et al.
patent: 6956259 (2005-10-01), Akasaka
patent: 7049647 (2006-05-01), Karcher et al.
patent: 2002/0158281 (2002-10-01), Goldbach et al.
patent: 2002/0190298 (2002-12-01), Alsmeier et al.
patent: 2004/0026727 (2004-02-01), Akasaka
patent: 199 46 719 (2001-04-01), None
patent: 101 28 718 (2003-01-01), None
patent: 102 55 847 (2004-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a trench capacitor with an insulation... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a trench capacitor with an insulation..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a trench capacitor with an insulation... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3761058

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.