Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma
Reexamination Certificate
2006-10-17
2006-10-17
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Plasma
C438S535000, C438S572000
Reexamination Certificate
active
07122451
ABSTRACT:
A semiconductor device has an active region composed of a group III–V nitride semiconductor and ohmic electrodes and a gate electrode each formed on the active region. The active region has an entire surface thereof exposed to a plasma such that a surface potential for electrons therein is lower than in the case where the entire surface is not exposed to the plasma.
REFERENCES:
patent: 6586781 (2003-07-01), Wu et al.
patent: 2002/0079508 (2002-06-01), Yoshida
patent: 4-250635 (1992-09-01), None
patent: 8-097238 (1996-04-01), None
patent: 8-195403 (1996-07-01), None
patent: 2001-274140 (2001-10-01), None
patent: 2001-274140 (2001-10-01), None
Zhang, et al., “Effect of N2 Discharge Treatment on AlGaN/gaN High Electron Mobility Transistor Ohmic Contacts Using Inductively Coupled Plasma”, J. Vac. Sci. Technol. A 18(4), Jul./Aug. 2000, pp. 1149-1152.
Hirose Yutaka
Ikeda Yoshito
Inoue Kaoru
Nishii Katsunori
Brewster William M.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Method for fabricating a semiconductor device including... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating a semiconductor device including..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a semiconductor device including... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3709746