Method for fabricating a semiconductor device having self...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07074682

ABSTRACT:
In order to provide a method for preventing the channel length from being shortened as well as reducing the SAS resistance, the semiconductor device according to the present invention is manufactured by forming continuous linear trench lines on a semiconductor substrate, forming gate oxide lines on the semiconductor substrate between the trench lines, forming gate lines on the trench lines and the gate oxide lines, the gate lines being substantially perpendicular to the trench lines, etching the gate oxide lines and trench lines positioned between the gate lines, to form an etched region forming self aligned sources (SASs) by implanting impurity ions into the etched region, forming spacers on sidewalls of the gate lines, and implanting impurity ions in the SAS region using the spacers as a mask.

REFERENCES:
patent: 5447877 (1995-09-01), Sasaki
patent: 5470773 (1995-11-01), Liu et al.
patent: 5482881 (1996-01-01), Chen et al.
patent: 5656513 (1997-08-01), Wang et al.
patent: 5933730 (1999-08-01), Sun et al.
patent: 6008516 (1999-12-01), Mehrad et al.
patent: 6211020 (2001-04-01), Tripsas et al.
patent: 6218265 (2001-04-01), Colpani
patent: 6228715 (2001-05-01), Shimoji
patent: 6235581 (2001-05-01), Chen
patent: 6436751 (2002-08-01), Liou et al.
patent: 6448608 (2002-09-01), Pham et al.
patent: 6524914 (2003-02-01), He et al.
patent: 6737321 (2004-05-01), Lee
patent: 2003/0011023 (2003-01-01), Hurley
patent: 2003/0013253 (2003-01-01), Hurley
patent: 2003/0022500 (2003-01-01), Tang
patent: 2003/0143790 (2003-07-01), Wu
patent: 2003/0232472 (2003-12-01), Wu
patent: 2004/0079987 (2004-04-01), Shimizu
patent: 2004/0161706 (2004-08-01), Jung et al.
patent: 2004/0166631 (2004-08-01), Hurley

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a semiconductor device having self... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a semiconductor device having self..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a semiconductor device having self... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3531733

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.