Method for fabricating a semiconductor device and the...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S486000, C438S530000, C257SE21421

Reexamination Certificate

active

08034689

ABSTRACT:
A method for fabricating a semiconductor device and the device made thereof are disclosed. In one aspect, the method includes providing a substrate comprising a semiconductor material. The method further includes patterning at least one fin in the substrate, the fin comprising a top surface, at least one sidewall surface, and at least one corner. A supersaturation of point defects is created in the at least one fin. The at least one fin is annealed and then cooled down such that semiconductor atoms of the semiconductor material migrate via the point defects.

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Lee, et al., Hydrogen Annealing Effect on DC and Low-Frequency Noise Characteristics in CMOS FinFETs, IEEE Electron Device Letters, vol. 24, No. 3, Mar. 2003.
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Zaman, et al., Effects of Hydrogen Annealing Process Conditions on Nano Scale Silicon, Mater. Res. Soc. Symp. Proc., vol. 872, Materials Research Society, 2005.
Extended European Search Report dated Jul. 21, 2008, for EP Application No. 08153499.2.

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