Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-06-13
2006-06-13
Goudreau, George A. (Department: 1763)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S719000, C438S725000, C438S734000, C438S736000
Reexamination Certificate
active
07060628
ABSTRACT:
A method for forming a patterned silicon-containing layer is disclosed. The method includes providing a substrate, providing a polysilicon layer on the substrate, providing a hard mask layer on the polysilicon layer, patterning and etching the hard mask layer and etching the polysilicon layer according to the pattern of the hard mask layer using a fluorine-containing etchant gas. The resulting sidewall profile of the etched polysilicon layer is substantially straight, uniform and devoid of a necking or notched configuration.
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Chiu Yuan-Hung
Huang Ming-Jie
Tao Hun-Jan
Goudreau George A.
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Assoc.
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