Method for fabricating a body contact in a Finfet structure...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S283000, C257SE21442

Reexamination Certificate

active

10968229

ABSTRACT:
A method for fabricating a Finfet device with body contacts and a device fabricated using the method are provided. In one example, a silicon-on-insulator substrate is provided. A T-shaped active region is defined in the silicon layer of the silicon-on-insulator substrate. A source region and a drain region form two ends of a cross bar of the T-shaped active region and a body contact region forms a leg of the T-shaped active region. A gate oxide layer is grown on the active region. A polysilicon layer is deposited overlying the gate oxide layer and patterned to form a gate, where an end of the gate partially overlies the body contact region to complete formation of a Finfet device with body contact.

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Edward J. Nowak et al., “Turning Silicon On Its Edge”, Overcoming Silicon Scaling Barriers With Double-Gate and FinFET Technology, Jan./Feb. 2004, pp. 20-30, IEEE Circuits & Devices Magazine, 8755-3996/04.

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