Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2008-03-27
2010-02-09
Allen, Andre J (Department: 2855)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
Reexamination Certificate
active
07658538
ABSTRACT:
A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
REFERENCES:
patent: 2008/0015827 (2008-01-01), Tryon et al.
patent: 2004-85397 (2004-03-01), None
patent: 2004-119434 (2004-04-01), None
Hirose Yoshiharu
Isogai Takefumi
Kadoura Hiroaki
Koike Hirofumi
Matsumoto Akikazu
Aisin Seiki Kabushiki Kaisha
Allen Andre J
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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