Method for electrically connecting a semiconductor chip to at le

Details Method for electrically connecting a semiconductor chip to at le Method for electrically connecting a semiconductor chip to at le

1998-03-26

1999-02-23

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438617, H01L 2144

Patent

active

058743545

ABSTRACT:
A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.

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