Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1997-04-17
1999-11-02
Breneman, Bruce
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
216 75, H01L 213065
Patent
active
059763949
ABSTRACT:
A method for dry etching a metallic thin film (i.e., platinum thin film) is disclosed whereby a clean metallic thin film can be formed by restraining redeposition of the metal. The etching gas includes a mixed gas including Cl.sub.2 and SiCl.sub.4 whereby a plasma of the mixed gas generates reactive species to react with the metallic thin film and form volatile residua that can be desorbed from the etched surface.
REFERENCES:
patent: 4135998 (1979-01-01), Gniewek et al.
patent: 5854104 (1998-12-01), Onishi et al.
Alanko Anita
Breneman Bruce
Samsung Electronics Co,. Ltd.
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