Method for directional grinding on backside of a...

Details Method for directional grinding on backside of a... Method for directional grinding on backside of a...

2011-02-22

2011-02-22

Eley, Timothy V (Department: 3724)

Abrading

Abrading process

Glass or stone abrading

C451S058000, C451S063000

Reexamination Certificate

active

07892072

ABSTRACT:
A backside grinding apparatus removes semiconductor material from a surface of a semiconductor wafer. The wafer is mounted to a backing plate. The backside surface undergoes a first grinding operation in a rotational motion to remove excess semiconductor material. The semiconductor wafer is then aligned such that edges of the die are oriented along a reference line. The backside surface undergoes a second grinding operation in a linear direction on a 45-diagonal with respect to the reference line to create linear grind marks which are diagonal to the edges of the die. The linear grind marks are formed by an abrasive surface having at least 4000 mesh count. The second grinding operation removes the radial grind marks produced by the first grinding operation. The linear grind marks oriented diagonal with respect to the reference line increases the strength of the die to resist cracking.

REFERENCES:
patent: 4096619 (1978-06-01), Cook, Jr.
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6261919 (2001-07-01), Omizo
patent: 7238543 (2007-07-01), Tandy et al.
patent: 2006/0079011 (2006-04-01), Tandy et al.

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