Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2008-01-14
2011-11-08
Ahmed, Samir (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S141000, C382S144000, C382S149000, C356S237100, C356S137000
Reexamination Certificate
active
08055057
ABSTRACT:
An inspection apparatus and a method for detecting defects in a substrate having a semiconductor device thereon are provided. The method includes establishing a first inspection region including first patterns repeatedly formed in a first direction and a second inspection region including second patterns repeatedly formed in a second direction on the substrate, determining a first unit inspection size of the first inspection region and a second unit inspection size of the second inspection region, obtaining images of the first and second patterns by moving the substrate in the first direction, and detecting defects in the first and second inspection regions by comparing the obtained images of portions of the first and second inspection regions, respectively, with each other. The first inspection size and second inspection size function as comparison units if defects are detected. The substrate may face an image receiving member.
REFERENCES:
patent: 2006/0068571 (2006-03-01), Chow et al.
patent: 2006/0082766 (2006-04-01), Kim et al.
patent: 2008/0063258 (2008-03-01), Kimba
patent: 2004-128197 (2004-04-01), None
patent: 2006-098163 (2006-04-01), None
patent: 1020040033525 (2004-04-01), None
patent: 1020060051443 (2006-05-01), None
Saito, JP2004-128197, the english version translated by machine.
Kang Moon-Shik
Kim Ji-Hye
Kim Jong-An
Lee Myung-Sub
Yang Yu-Sin
Ahmed Samir
Harness & Dickey & Pierce P.L.C.
Li Ruiping
Samsung Electronics Co,. Ltd.
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