Method for deposition of silicon films from azidosilane sources

Fishing – trapping – and vermin destroying

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427 51, 148DIG122, H01L 21469

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active

050136909

ABSTRACT:
A low temperature chemical vapor deposition process comprising heating in a chemical vapor depositon reactor a substrate upon which deposition is desired to a temperature of from about 550.degree. C. to about 750.degree. C. in a chemical vapor deposition reactor having a pressure of from about 0.1 torr to approximately atmospheric pressure, introducing into the reactor a silicon-containing feed and optionally an oxygen containing feed, said silicon containing feed consisting essentially of one or more compounds having the general formula ##STR1## wherein: R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are hydrogen, azido or C-2 to C-6 alkyl, aryl or C-7 to C-10 aralkyl groups, at least one but not more than three of R.sub.1, R.sub.2, R.sub.3 and R.sub.4, being azido, and maintaining the temperature and pressure to cause a film of silicon nitride, silicon oxynitride or silicon dioxide to deposit is disclosed.

REFERENCES:
patent: 4158717 (1979-06-01), Nelson
patent: 4569855 (1986-02-01), Matsuda et al.
patent: 4963506 (1990-10-01), Liaw et al.

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