Method for depositing silicon nitride films and silicon...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – By reaction with substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06936548

ABSTRACT:
A method for producing silicon nitride and silicon oxynitride films by CVD technology, where even at lower temperatures, acceptable film-deposition rates are achieved, without the by-product production of large amounts of ammonium chloride.

REFERENCES:
patent: 5874368 (1999-02-01), Laxman et al.
patent: 5976991 (1999-11-01), Laxman et al.
patent: 0 935 284 (1999-08-01), None
patent: 62 050466 (1987-07-01), None
patent: 02 138471 (1990-05-01), None
patent: 08 022986 (1996-01-01), None
International Search Report for PCT/EP02/13869.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for depositing silicon nitride films and silicon... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for depositing silicon nitride films and silicon..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for depositing silicon nitride films and silicon... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3450787

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.