Method for creating a stepped structure on a substrate

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S224000, C438S419000, C438S420000, C438S527000, C438S942000, C257SE21330, C257SE21258, C257SE21644, C148SDIG001

Reexamination Certificate

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06946339

ABSTRACT:
In a method for creating a stepped structure on a substrate, which at least includes a first portion with a first thickness and a second portion with a second thickness, at first a layer sequence of a first oxide layer, a first nitride layer, and a second oxide layer is applied onto the substrate. Then a portion of the second oxide layer and a portion of the first nitride layer are removed to expose a portion of the first oxide layer. Then a part of the first nitride layer is removed to establish the first region of the stepped structure. Then the thickness of the first oxide layer is changed at least in the established first region to establish the first thickness of this region. Subsequently, a further part of the first nitride layer is removed to establish a second region of the stepped structure.

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English Translation of Abstract for Japanese Publication No. 02087675, Mar. 28, 1990.

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