Method for coating heterogeneous substrates with homogeneous lay

Details Method for coating heterogeneous substrates with homogeneous lay Method for coating heterogeneous substrates with homogeneous lay

1996-11-06

1999-11-02

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

2041921, 427250, 42725527, 427264, 427270, 427271, 427294, 427404, 4274197, 427574, 427576, 427579, 427585, H05H 120

Patent

active

059766379

ABSTRACT:
The present invention is predicated on applicants' discovery that inhomogeneity in films deposited on heated heterogeneous substrates can be substantially reduced by patterning the large area metal structures. Specifically, metal structures having areas in excess of about 2 mm.sup.2 are patterned so that the metal is within 1 mm of a metal edge. Thus, for example, a normally solid chromium bonding pad on a glass substrate is conveniently made as a patterned, open grid of 1 mm chromium lines. With such patterning, a subsequently deposited layer of silicon nitride has enhanced homogeneity over a large area, including enhanced uniformity of etching rate.

REFERENCES:
patent: 5346601 (1994-09-01), Barada et al.
F.B. Kaufman et al., "Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects", Journal of the Electrochemical Society, vol. 138, No. 11, Nov. 1991.

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