4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Plasma

Jeffrey Alan Gregus

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Flip chip metallization

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent

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Flip chip metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method for coating heterogeneous substrates with homogeneous lay

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent

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Profile ID: LFUS-PAI-P-1861314

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