Method for changing threshold voltage of device in resist asher

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S689000, C257SE21703, C257SE21122

Reexamination Certificate

active

11136131

ABSTRACT:
A method for forming a dopant in a substrate, by accumulating at least one dopant species in an asher chamber and forming the accumulated dopant species on an exposed portion of the substrate. A target concentration for the plasma chamber dopant species is determined by test or measurement. The asher is used to form the dopant species on the substrate, and the dopant species is driven into the substrate. A threshold voltage is measured on the substrate to verify or confirm that a proper dopant level has been achieved.

REFERENCES:
patent: 4578128 (1986-03-01), Mundt et al.
patent: 5989963 (1999-11-01), Luning et al.
patent: 6015740 (2000-01-01), Milic-Strkalj
patent: 6420279 (2002-07-01), Ono et al.
patent: 6426302 (2002-07-01), Kitagawa
patent: 6440864 (2002-08-01), Kropewnicki et al.
patent: 6517738 (2003-02-01), Torek et al.
patent: 6524936 (2003-02-01), Hallock et al.
patent: 6893907 (2005-05-01), Maydan et al.
patent: 6939434 (2005-09-01), Collins et al.
patent: 6951823 (2005-10-01), Waldfried et al.
patent: 6967154 (2005-11-01), Meng et al.
patent: 7094670 (2006-08-01), Collins et al.
patent: 2002/0048731 (2002-04-01), Mullee
patent: 2002/0151156 (2002-10-01), Hallock et al.
patent: 2005/0136604 (2005-06-01), Al-Bayati et al.
patent: 2006/0017138 (2006-01-01), Ting
patent: 2007/0072422 (2007-03-01), Yeh
patent: 1054433 (2000-11-01), None
S. Fujimura et al., “Additive Nitrogen Effects on Oxygen Plasma Downstream Ashing”, Japanese Journal of Applied Physics, vol. 29, No. 10, Oct. 1990, pp. 2165-2170.
L. Kassel et al., “Chamber Contamination in Ashing Processes of Ion Implanted Photoresist”, S.P.I.E., vol. 1803, 1992, 0-8194-1001-2/93, pp. 89-96.
J.R. Hu et al., “Resist Shipping for Multilevel Interconnect Integrating Low k Dielectric Material”, AVS First Int'l Conference on Microelectronics and Interfaces, Feb. 2000, 4 pages.
Compilation tables of inorganic compounds: Handbook of Chemistry and Physics, 69thEdition, CRC Press, p. D-192 thru D.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for changing threshold voltage of device in resist asher does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for changing threshold voltage of device in resist asher, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for changing threshold voltage of device in resist asher will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3893138

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.