Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Including heating
Patent
1998-07-21
2000-04-18
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Including heating
4273722, G03F 700
Patent
active
060513713
ABSTRACT:
A photomask substrate, which is formed in a rectangular shape and on the surface of which photoresist is applied, is located above a lower heating plate so as to be separated from the lower heating plate by a proximity distance. The lower heating plate is provided with a heat unifying ring fixedly arranged thereon so as to surround the photomask substrate. The periphery of the heat unifying ring is provided with a taper section tapered at a predetermined angle to the periphery. The heat unifying ring has a container for containing the photomask substrate, at the central portion. An upper heating plate is arranged above the lower heating plate. The upper heating plate is provided with a baking chamber thereabove to cover the entire portion of the baking chamber section, thereby the baking chamber section can be shielded from the outside and free from the influence of the outside.
REFERENCES:
patent: 4832781 (1989-05-01), Mears
patent: 4863547 (1989-09-01), Shidahara
patent: 4886571 (1989-12-01), Suzuki et al.
patent: 4981103 (1991-01-01), Sekiguchi et al.
patent: 5051338 (1991-09-01), Kato
patent: 5240505 (1993-08-01), Iwasaki et al.
patent: 5314541 (1994-05-01), Saito et al.
patent: 5344492 (1994-09-01), Sato et al.
patent: 5372648 (1994-12-01), Yamamoto et al.
patent: 5462014 (1995-10-01), Awaya et al.
patent: 5462603 (1995-10-01), Murakami
patent: 5487786 (1996-01-01), Childa et al.
Akasaki Tsuneo
Kanda Kaoru
Matsuoka Yasuo
Mita Katsuhisa
Takano Michirou
Barreca Nicole
Duda Kathleen
Kabushiki Kaisha Toshiba
LandOfFree
Method for baking photoresist applied on substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for baking photoresist applied on substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for baking photoresist applied on substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2335232