Method for analyzing fail bit maps of wafers

Details Method for analyzing fail bit maps of wafers Method for analyzing fail bit maps of wafers

2006-11-21

2006-11-21

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C257SE21531

Reexamination Certificate

active

07138283

ABSTRACT:
A method of detecting a wafer failure includes extracting the wafer ID of a target wafer in the target lot from the lot ID, extracting the location information of a failure in the target wafer, calculating a to-be-quantified first wafer feature amount for unevenness of a wafer failure distribution, calculating a first lot feature amount for each target lot, extracting a fabrication process for the target lot and a fabrication apparatus, carrying out a significant test for the fabrication apparatus used in each fabrication process, and detecting the fabrication apparatus with a significant difference as a first abnormal apparatus.

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