Method for adjusting substrate processing times in a...

Details Method for adjusting substrate processing times in a... Method for adjusting substrate processing times in a...

2007-02-13

2007-02-13

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S006000

Reexamination Certificate

active

11328959

ABSTRACT:
Aspects of the present invention include a method and an apparatus that may be utilized to adjust processing times in a substrate processing system. In one embodiment of the present invention, a pre-processing thickness measurement of a substrate while the substrate is in one of the polishing stations is taken. Then the substrate is processed in the polishing system for a predetermined processing time. A post-processing thickness measurement is taken while the substrate is in one of the polishing stations. A removal rate is calculated based on the pre-processing and the post-processing measurements and the predetermined processing time. A processing time is adjusted for one or more of the polishing stations based on the removal rate for use in subsequent processing of a production substrate.

REFERENCES:
patent: 6530822 (2003-03-01), Lin
patent: 6623333 (2003-09-01), Patel et al.
patent: 6827629 (2004-12-01), Kim et al.
patent: 6939198 (2005-09-01), Swedek et al.
patent: 7004814 (2006-02-01), Chen et al.
patent: 2005/0020185 (2005-01-01), Zuniga et al.

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