Method for a junction field effect transistor with reduced...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate

Reexamination Certificate

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C438S270000

Reexamination Certificate

active

07452763

ABSTRACT:
A method for fabricating a dual gate structure for JFETs and MESFETs and the associated devices. Trenches are etched in a semiconductor substrate for fabrication of a gate structure for a JFET or MESFET. A sidewall spacer may be formed on the walls of the trenches to adjust the lateral dimension for a first gate. Following the formation of the first gate by implantation or deposition, a buffer region is implanted below the first gate using a complementary dopant and a second sidewall spacer with a thickness that may be the same or greater than the thickness of the first sidewall spacer. Subsequent to the buffer implant, a second gate is implanted beneath the buffer layer using a third sidewall spacer with a greater thickness than the first sidewall spacer.

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