Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent
1997-10-16
1998-07-28
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
257686, 257725, 257783, H01L 2306, H01L 2302
Patent
active
057866287
ABSTRACT:
A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film layer is separately formed on a temporary support which is used to attach the thin-film layer to the electronic module. The disclosed techniques may also be used for attaching an interposer, which may include active circuity, to an electronic module. Specific details of the fabrication method, resulting multichip packages, and various thin-film structures are set forth.
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Beilstein, Jr. Kenneth Edward
Bertin Claude Louis
Cronin John Edward
Howell Wayne John
Leas James Marc
International Business Machines - Corporation
Ostrowski David
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