Method and system for performing die attach using a flame

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S632000

Reexamination Certificate

active

11020433

ABSTRACT:
Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.

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