4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Tom M. Lappin

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Gap control between interposer and substrate in electronic...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
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Method and system for performing die attach using a flame

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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