Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate
2008-09-23
2010-11-23
Choi, William C (Department: 2873)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
C438S462000, C257S797000
Reexamination Certificate
active
07838386
ABSTRACT:
Disclosed is a method and a system for forming alignment marks on a transparent substrate. A light reflective layer is deposited over an optically transparent substrate of a wafer. A region is defined around an alignment mark on the optically transparent substrate. The light reflective layer is removed from a substantial portion of the transparent substrate excluding the region. In addition, a micro electro-mechanical systems device is disclosed. The device comprises an optically transparent substrate, at least one optically partially transparent alignment mark on the optically transparent substrate, and a plurality of reflective elements or imaging pixels attached to the optically transparent substrate.
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Gau Tsai-Sheng
Jang Ruei-Hung
Lee Ya-Wen
Lin Chin-Hsiang
Pan Sheng-Liang
Choi William C
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
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