Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2008-06-24
2008-06-24
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE21567
Reexamination Certificate
active
07390724
ABSTRACT:
A system for manufacturing multilayered substrates. The system has a support member is adapted to process a film of material comprising a first side and a second side from a first state to a second state. The support member is attached to the first side of the film of material. The second state comprises a stressed state. The system has a handle substrate comprising a face, which is adapted to be attached to the second side of the film of material. The support member is capable of being detached from the first side of the film of material thereby leaving the handle substrate comprising the film of material in the second state being attached to the face of the handle substrate.
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Henley Francois J.
Malik Igor J.
Ong Philip James
Silicon Genesis Corporation
Townsend and Townsend / and Crew LLP
Zarneke David A
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