4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Silicon Genesis Corporation

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Cleaved silicon thin film with rough surface

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Cleaving process to fabricate multilayered substrates using...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
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Cleaving process to fabricate multilayered substrates using...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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Cleaving process to fabricate multilayered substrates using...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
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Cluster tool apparatus using plasma immersion ion implantation

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
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Profile ID: LFUS-PAI-P-392021

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