Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-06-12
2007-06-12
Bali, Vikkram (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
10050519
ABSTRACT:
For the purpose of reducing a false report and shortening inspection time, an area to be inspected is locally inspected under optimum inspection conditions. In order to avoid the number of detected defects from increasing explosively, and thereby to facilitate control of a critical defect, general-purpose layout data, which is used for producing a mask of a semiconductor wafer, is accumulated in a design information server2. With reference to the layout data, an area to be inspected, which is inspected by a pattern inspecting apparatus1, is divided into partial inspection areas including a cell portion and a non-cell portion. Inspection parameters are set for each of the partial inspection areas. In addition, the defect reviewing apparatus8obtains an inspection result of the pattern inspecting apparatus1. When obtaining a defect image, the defect reviewing apparatus8identifies a position, where the defect occurred, from among a cell portion, a non-cell portion, a pattern dense portion, and the like according to layout data. Moreover, the defect reviewing apparatus8sets inspection parameters, such as pickup magnification of this defect, in response to a result of the identification to set a control criterion of criticality.
REFERENCES:
patent: 6466895 (2002-10-01), Harvey et al.
patent: 6483937 (2002-11-01), Samuels
patent: 62-43505 (1987-02-01), None
patent: 10-135228 (1998-05-01), None
Maeda Shunji
Noguchi Minori
Okuda Hirohito
Ono Makoto
Ooshima Yoshimasa
Antonelli, Terry Stout & Kraus, LLP.
Bali Vikkram
Hitachi , Ltd.
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