Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage
Patent
1994-05-26
1996-07-09
Limanek, Robert P.
Optics: measuring and testing
By configuration comparison
With comparison to master, desired shape, or reference voltage
356376, 356237, 25055901, 25055942, G01B 1124
Patent
active
055350062
ABSTRACT:
A method of evaluating integrity of adherence of a conductor bond to a substrate includes: a) impinging a plurality of light sources onto a substrate; b) detecting optical reflective signatures emanating from the substrate from the impinged light; c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; d) determining a target site on the selected conductor bond from the detected reflective signatures; e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method.
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Siu Bernard K.
Telschow Kenneth L.
Hardy David B.
Limanek Robert P.
Lockheed Idaho Technologies Company
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