Method and system for determining repeatable yield...

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing

Reexamination Certificate

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C714S732000

Reexamination Certificate

active

06971054

ABSTRACT:
An exemplary embodiment of the present invention is a method for testing an integrated circuit. The method includes generating a test pattern and generating a reference signature corresponding to the test pattern. An integrated circuit test is executed in response to the test pattern and a result signature is generated in response to data output from executing the integrated circuit test. The result signature is compared to the reference signature and a current failing signature is created if the two don't match. The current failing signature is copy of the result signature. Common error analysis is executed in response to creating the current failing signature. Additional embodiments include a system and storage medium for testing an integrated circuit.

REFERENCES:
patent: 3761695 (1973-09-01), Eichelberger
patent: 4503536 (1985-03-01), Panzer
patent: 5515384 (1996-05-01), Horton, III
patent: 5727000 (1998-03-01), Pizzica
patent: 5925144 (1999-07-01), Sebaa
patent: 5930270 (1999-07-01), Forlenza et al.
patent: 5938784 (1999-08-01), Kim
patent: 5983009 (1999-11-01), Lepejian et al.
patent: 5983380 (1999-11-01), Motika et al.
patent: 6012157 (2000-01-01), Lu
patent: 6021514 (2000-02-01), Koprowski
patent: 6202181 (2001-03-01), Ferguson et al.
patent: 6442723 (2002-08-01), Koprowski et al.
patent: 6557132 (2003-04-01), Gangl et al.
patent: 6643807 (2003-11-01), Heaslip et al.
patent: 6725403 (2004-04-01), Schmoelz
“Efficient Implementation of Multiple On-Chip Signature Checking” Abdulla et al. 10th International Conference on VLSI Design Publication Date: Jan. 4-7, 1997 pp. 297-302 Inspec Accession No.: 5565767.
“Predicting Failing Bitmap Signatures for Memory Arrays with Critical Area Analysis” Segal et al. Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI Publication Date: Sep. 8-10, 1999 pp. 178-182 Inspec Accession No.: 6512794.
“Maximization of Self-Test Coverage in a Hardware Design”, IBM Technical Disclosure Bulletin, vol. 35 No. 1A, Jun. 1992.
“A Logic Design Structure For LSI Testability”, E.B. Eichelberger and T.W. Williams, Proceedings of the 14th Design Automation, New Orleans, pp. 462-468, 1977.
“Self-Testing Of Multichip Logic Modules”, P.H. Bardell and W.H. McAnney, Proceedings of the IEEE International Test Conference, pp. 200-204, 1982.

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