Method and system for chemical mechanical polishing pad...

Details Method and system for chemical mechanical polishing pad... Method and system for chemical mechanical polishing pad...

2007-09-18

2007-09-18

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S041000, C451S443000, C451S444000, C438S692000, C156S345120, C134S002000, C134S003000

Reexamination Certificate

active

11256293

ABSTRACT:
In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and the pad surface is rinsed so as to substantially remove by-product produced by the chemicals. A mechanical conditioning operation is performed on the surface of the pad. The wafer surface includes copper and oxide during the CMP operation.

REFERENCES:
patent: 5725417 (1998-03-01), Robinson
patent: 6234877 (2001-05-01), Koos et al.
patent: 6258721 (2001-07-01), Li et al.
patent: 6312319 (2001-11-01), Donohue et al.

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