Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1997-12-23
1999-01-19
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257782, 257778, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
058616780
ABSTRACT:
A method for attaching bumped semiconductor dice to substrates, such as printed circuit boards and multi chip modules, is provided. The method includes the steps of: providing an instant curing adhesive formulated to cure within 0.25 to 60 seconds, and dispensing a volume of the adhesive onto the substrate. The method also includes the steps of heating the die, and aligning the contact bumps on the die to the contacts on the substrate. Following these steps the die can be brought into contact with the substrate to form an adhesive layer therebetween. Heat from the die cures the adhesive layer. In addition, the cured adhesive layer tensions the die against the substrate, and compresses the contact bumps and contacts to form low resistance electrical connections. A system for performing the method includes a lead-on-chip die attacher configured to heat the die, to dispense the adhesive, to align the die and substrate, and then to press the die against the substrate with a desired pressure.
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Clark S. V.
Gratton Stephen A.
Jr. Carl Whitehead
Micro)n Technology, Inc.
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