Method and structure of memory element plug with conductive...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S003000, C438S243000, C438S253000, C438S386000, C438S387000, C438S396000, C257S077000, C257S296000, C257S301000, C257S303000, C257S306000, C257S310000, C257S532000

Reexamination Certificate

active

07129133

ABSTRACT:
Disclosed are methods and structures for fabrication of reliable and efficient memory cells. The methods involve formation of a conformal diffusion barrier layer in a via, deposition of an electrode material in the via, removal of a certain portion of the electrode material from the via to expose a the portion of the diffusion barrier layer, converting the exposed portion of the diffusion barrier layer into an oxide, forming a memory element film, and forming and patterning a top electrode. Improved electrical conduction and data retention from the memory element of a memory cell by preventing short circuits and leakage of current through the conductive diffusion barrier layer, and thereby enhanced reliability and performance of a memory cell are obtained.

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