Method and structure for non-single-polycrystalline...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Reexamination Certificate

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07098103

ABSTRACT:
A method of forming a non-single-crystalline capacitor in an integrated circuit. It includes the steps of forming a first non-single-crystalline layer on a gate dielectric layer of a substrate of an integrated circuit. Next, a capacitor dielectric layer is formed on the first non-single-crystalline layer, and a second non-single-crystalline layer is formed on the capacitor dielectric layer. Portions of the second non-single-crystalline layer are removed to define a top plate of the capacitor. Portions of the capacitor dielectric layer are removed to define a dielectric of the capacitor. Also, portions of the first non-single-crystalline layer are removed to define the bottom plate of the capacitor.

REFERENCES:
patent: 5110752 (1992-05-01), Lu
patent: 5126280 (1992-06-01), Chan et al.
patent: 5166090 (1992-11-01), Kim et al.
patent: 5173437 (1992-12-01), Chi
patent: 5262343 (1993-11-01), Rhodes et al.
patent: 5550077 (1996-08-01), Tseng et al.
patent: 6420222 (2002-07-01), Watanabe

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