Method and materials to control doping profile in integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S607000, C257SE21567, C257SE29287, C438S311000

Reexamination Certificate

active

07629649

ABSTRACT:
Methods and materials for silicon on insulator wafer production in which the doping concentration in a handle wafer is sufficiently high to inhibit dopant from diffusing from the bond wafer during or after bonding to the handle wafer.

REFERENCES:
patent: 6008110 (1999-12-01), Samata et al.
patent: 6229177 (2001-05-01), Yeap et al.
patent: 6232636 (2001-05-01), Simpson et al.
patent: 6313489 (2001-11-01), Letavic et al.
patent: 6635928 (2003-10-01), Mouli
patent: 6693022 (2004-02-01), Dreybrodt et al.
patent: 6946364 (2005-09-01), Czagas et al.
patent: 2003/0075260 (2003-04-01), Mitani
patent: 2003/0178678 (2003-09-01), Wei et al.
patent: 2004/0075143 (2004-04-01), Bae et al.
patent: 2004/0169227 (2004-09-01), Wei et al.
patent: WO-2007133935 (2007-11-01), None
patent: WO-2007133935 (2007-11-01), None
http://www.ee.byu.edu/cleanroom/ResistivityCal.phtml Brigham Young University, Department of Electrical & Computer Engineering, “resistivity & mobility calculator/graph for various doping concentrations in silicon”, 2004.
H.T.M. Pham et al., “Evaluation of In-Situ Doped PECVD SiC Thin Films for Surface Micromachining”, Delft Univ. of Tech., Dimes, Laboratory of Electronic Components, Faculty of Applied Sciences, Dept. of Material Science & Tech., Delft the Netherlands, pp. 856-860.
P. Lin et al., “Multi-User Hybrid Process Platform for MEMS Devices Using Silicon-on-Insulator Wafers”, Infotonics Tech. Ctr., Canandiagua, NY, USA, 4 pages.
W.A. Nevin et al., “Effect of Material Properties on Stress-Induced Defect Generation in Trenched SOI”, BCO Tech. (NI) Ltd., Belfast, Ireland, U.K., 8 pages.
G.K. Geller, “Frontiers of Silicon-on-Insulator”, Applied Physics Reviews, Journal of Applied Physics, vol. 93, No. 9, May 2003, pp. 4955-4978.
-, “International Application Serial No. PCT/US2007/067939, Search Report mailed Jul. 3, 2008”, 4 pgs.
-, “International Application Serial No. PCT/US2007/067939, Written Opinion mailed Jul. 3, 2008”, 9 pgs.

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