Method and device for transferring a solder deposit...

Details Method and device for transferring a solder deposit... Method and device for transferring a solder deposit...

2011-04-19

2011-04-19

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Preplacing solid filler

C228S246000

Reexamination Certificate

active

07926699

ABSTRACT:
Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum impingement (27) by the isolation unit (12).

REFERENCES:
patent: 5205896 (1993-04-01), Brown et al.
patent: 2003/0111508 (2003-06-01), Cobbley et al.
patent: 0 673 188 (1995-09-01), None
patent: 08153961 (1996-06-01), None
patent: 2002-093836 (2002-03-01), None
Translation of JP-2002-093836A.
International Search Report corresponding to PCT/DE2005/001698, under date of mailing of Dec. 16, 2005.

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