4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Pac Tech—Packaging Technologies GmbH

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Device for alternately contacting two wafers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method and device for transferring a solder deposit...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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