4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Smart Pac GmbH - Technology Services

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Chip module and chip card module for producing a chip card

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Contact-bumpless chip contacting method and an electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method and device for transferring a solder deposit...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Method for producing a contact substrate and corresponding...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method for the production of a soldered connection

Metal fusion bonding – Process – Plural joints
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