Optics: measuring and testing – By configuration comparison – With photosensitive film or plate
Reexamination Certificate
1999-08-13
2001-08-21
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
By configuration comparison
With photosensitive film or plate
C356S389000, C033S550000
Reexamination Certificate
active
06278520
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to measuring devices, particularly, micrometers. Specifically, the micrometer of the present invention includes a novel fixture as well as method and processor for determining the maximum diameter of a work piece along the length of the work piece.
2. Related Art
There exists numerous micrometers, gauges and instruments and methods for measuring parts. The ability gain an accurate measurement of the part is a function of the limitations of the method and device as well as the particular characteristics of the part to be measured. For example, parts can be hard, soft, radioactive, delicate, sterile, brittle, etc. In the case of parts which cannot be handled in the area of measurement in order to obtain accuracy, non-contact gauging methods and devices have been employed.
One technique which has been employed to obtain accurate measurements in non-contact environments is to employ a laser transmitter, receiver, and processor. The laser transmitter passes beam of light wider than the object to be measured and a receiver detects the portion of the beam which passes about the object. The portion of the beam which does not pass to the receiver generally represents the size of the object. The received beam is manipulated by the processor to provide a readout of the size of the object.
While this type of measuring device and method has proved to be very useful, there remains a need to improve the technology. For example, the existing techniques do not provide for accurate measurement where high degree of tolerances are required. The object's circumference often varies in size and depending on its position in which it is placed in the path of the beam, e.g., a cylindrical piece will vary in its circumference as it is rotated.
Thus, there is a need to provide a quick and reliable method and device for accurately ascertaining the size of objects. The present invention provides such a device and method.
BRIEF SUMMARY OF THE INVENTION
It is an object to improve measuring techniques.
It is a further object to improve upon the devices for measuring.
It is another object to improve upon laser micrometer devices and measuring techniques using the same.
Accordingly, one embodiment of the present invention is directed to a method of measuring a part, such as tubing, pipe, hose, cable, for example. The method includes the steps of
(a) disposing a first part of a generally cylindrical work piece in a path of a laser beam such that a first portion of the beam passes by one side of the work piece;
(b) positioning a laser beam receiving processor in a manner to receive the first portion of the laser beam in order to enable a determination a size of the first part;
(c) disposing a second part of the generally cylindrical work piece in a generally V-shaped seat such that the work piece contacts two sides of the V-shaped seat; and
(d) applying sufficient force on the second part in a manner to cause slidable rotation of the work piece in the V-shaped seat while maintaining contact with the two sides. The method further characterizes the step of (a) as disposing the first part in the laser beam such that a second portion of the laser beam passes by another side of the work piece.
The method further characterizes the step (b) to position the laser beam receiving processor in a manner to receive the second portion of the laser beam in order to enable a determination a size of the first part, wherein the size is determined as a function of distance between first portion and the second portion of laser beam. The method may also be characterized as having a known laser beam scan width and performing a plurality of size determinations as the work piece is rotated to determine the maximum and minimum size of the first part. The method further includes disposing the work piece perpendicular to a path of the laser beam. The method may also include passing the laser beam axially across the work piece.
In another embodiment, the invention is directed to a fixture for use with a laser micrometer. The fixture includes a V-shaped seat having a first side surface and a second side surface, wherein the surfaces form a seat to receive a generally cylindrical work piece, and apparatus for rotating the work piece in a manner to cause slidable rotation of the work piece in the V-shaped seat while maintaining contact with the two sides.
Still another embodiment includes a laser micrometer for generating a laser beam path such that a first portion of the beam passes by one side of a work piece, and a laser beam receiving processor in a manner to receive the first portion of the laser beam in order to enable a determination a size of the first part. The laser micrometer includes the V-shaped fixture operably connected thereto.
Other objects and advantages will be readily apparent to those skilled in the art upon viewing the drawings and reading the detailed description hereafter.
REFERENCES:
patent: 4213707 (1980-07-01), Evans, Jr.
patent: 4492473 (1985-01-01), Richter et al.
patent: 4884605 (1989-12-01), Ely
patent: 4991308 (1991-02-01), Donaldson
patent: 5113591 (1992-05-01), Connelly
patent: 5175595 (1992-12-01), Fukase
patent: 5311291 (1994-05-01), Cholet
Boyd Scott
Krabacher Kenneth Daniel
Beta Laser Mike, Inc.
Graham R. William
Pham Hoa Q.
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