Method and composition for polishing a substrate

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With programmed – cyclic – or time responsive control

Reexamination Certificate

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C205S662000, C205S682000

Reexamination Certificate

active

10608404

ABSTRACT:
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

REFERENCES:
patent: 2582020 (1952-01-01), Emery
patent: 3239441 (1966-03-01), Marosi
patent: 3873512 (1975-03-01), Latanision
patent: 4263113 (1981-04-01), Bernard
patent: 4369099 (1983-01-01), Kohl et al.
patent: 4663005 (1987-05-01), Edson
patent: 4666683 (1987-05-01), Brown et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4941082 (1990-07-01), Edson
patent: 4992135 (1991-02-01), Doan
patent: 5002645 (1991-03-01), Eastland et al.
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5114548 (1992-05-01), Rhoades
patent: 5129981 (1992-07-01), Wang et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5407526 (1995-04-01), Danielson et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 5783489 (1998-07-01), Kaufman et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5843032 (1998-12-01), Kastenhofer
patent: 5846882 (1998-12-01), Birang
patent: 5866031 (1999-02-01), Carprio et al.
patent: 5880003 (1999-03-01), Hayashi
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6007630 (1999-12-01), Datta
patent: 6056864 (2000-05-01), Cheung
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6077412 (2000-06-01), Ting et al.
patent: 6083840 (2000-07-01), Mravic et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6096652 (2000-08-01), Watts et al.
patent: 6099604 (2000-08-01), Sandhu et al.
patent: 6103096 (2000-08-01), Datta
patent: 6116785 (2000-09-01), Kondo et al.
patent: 6117775 (2000-09-01), Kondo et al.
patent: 6117783 (2000-09-01), Small et al.
patent: 6117853 (2000-09-01), Sakai et al.
patent: 6126853 (2000-10-01), Kaufman et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6143656 (2000-11-01), Yang et al.
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6171352 (2001-01-01), Lee et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6177026 (2001-01-01), Wang et al.
patent: 6190237 (2001-02-01), Huyng et al.
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6217416 (2001-04-01), Kaufman et al.
patent: 6218305 (2001-04-01), Hosali et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238592 (2001-05-01), Hardy et al.
patent: 6248222 (2001-06-01), Wang
patent: 6258711 (2001-07-01), Laursen et al.
patent: 6258721 (2001-07-01), Li et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6303049 (2001-10-01), Lee et al.
patent: 6303551 (2001-10-01), Li et al.
patent: 6310019 (2001-10-01), Kakizawa et al.
patent: 6315803 (2001-11-01), Ina et al.
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6348076 (2002-02-01), Canaperi et al.
patent: 6354916 (2002-03-01), Uzoh et al.
patent: 6355075 (2002-03-01), Ina et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6375693 (2002-04-01), Cote et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6416685 (2002-07-01), Zhang et al.
patent: 6419554 (2002-07-01), Chopra et al.
patent: 6428721 (2002-08-01), Ina et al.
patent: 6429133 (2002-08-01), Chopra
patent: 6440186 (2002-08-01), Sakai et al.
patent: 6440295 (2002-08-01), Wang
patent: 6447371 (2002-09-01), Brusic Kaufman et al.
patent: 6447668 (2002-09-01), Wang
patent: 6454819 (2002-09-01), Yano et al.
patent: 6455479 (2002-09-01), Sahbari
patent: 6508952 (2003-01-01), Lee et al.
patent: 6541384 (2003-04-01), Sun et al.
patent: 6551935 (2003-04-01), Sinha et al.
patent: 6555158 (2003-04-01), Yoshio et al.
patent: 6562719 (2003-05-01), Kondo et al.
patent: 6565619 (2003-05-01), Asano et al.
patent: 6579153 (2003-06-01), Uchikura et al.
patent: 6593239 (2003-07-01), Kaufman et al.
patent: 6596152 (2003-07-01), Yang et al.
patent: 6596638 (2003-07-01), Kondo et al.
patent: 6602112 (2003-08-01), Tran et al.
patent: 6605537 (2003-08-01), Bian et al.
patent: 6616976 (2003-09-01), Montano et al.
patent: 6620215 (2003-09-01), Li et al.
patent: 6653242 (2003-11-01), Sun et al.
patent: 6676484 (2004-01-01), Chopra
patent: 6679928 (2004-01-01), Costas et al.
patent: 6679929 (2004-01-01), Asano et al.
patent: 6693036 (2004-02-01), Nogami et al.
patent: 6699299 (2004-03-01), Sanchan et al.
patent: 6736952 (2004-05-01), Emesh et al.
patent: 6811680 (2004-11-01), Chen et al.
patent: 6893476 (2005-05-01), Siddiqui et al.
patent: 2001/0016469 (2001-08-01), Chopra
patent: 2001/0024878 (2001-09-01), Nakamura
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0042690 (2001-11-01), Talieh
patent: 2001/0052351 (2001-12-01), Brown et al.
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0016064 (2002-02-01), Komai et al.
patent: 2002/0016272 (2002-02-01), Kakizawa et al.
patent: 2002/0040100 (2002-04-01), Kume et al.
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0072309 (2002-06-01), Sato et al.
patent: 2002/0074230 (2002-06-01), Basol
patent: 2002/0088709 (2002-07-01), Hongo et al.
patent: 2002/0096659 (2002-07-01), Sakai et al.
patent: 2002/0104764 (2002-08-01), Banerjee et al.
patent: 2002/0108861 (2002-08-01), Emesh et al.
patent: 2002/0108864 (2002-08-01), Yang et al.
patent: 2002/0130049 (2002-09-01), Chen et al.
patent: 2002/0139055 (2002-10-01), Asano et al.
patent: 2002/0160698 (2002-10-01), Sato et al.
patent: 2002/0182982 (2002-12-01), Li et al.
patent: 2003/0073311 (2003-04-01), Levert et al.
patent: 2003/0073386 (2003-04-01), Ma et al.
patent: 2003/0079416 (2003-05-01), Ma et al.
patent: 2003/0083214 (2003-05-01), Kakizawa et al.
patent: 2003/0104762 (2003-06-01), Sato et al.
patent: 2003/0113996 (2003-06-01), Nogami et al.
patent: 2003/0114004 (2003-06-01), Sato et al.
patent: 2003/0115475 (2003-06-01), Russo et al.
patent: 2003/0116445 (2003-06-01), Sun et al.
patent: 2003/0116446 (2003-06-01), Duboust et al.
patent: 2003/0136055 (2003-07-01), Li et al.
patent: 2003/0153184 (2003-08-01), Wang et al.
patent: 2003/0170091 (2003-09-01), Shomler et al.
patent: 2003/0178320 (2003-09-01), Liu et al.
patent: 2003/0216045 (2003-11-01), Wang et al.
patent: 2003/0234184 (2003-12-01), Liu et al.
patent: 2004/0053499 (2004-03-01), Liu et al.
patent: 2004/0144038 (2004-07-01), Siddiqui
patent: 2004/0248412 (2004-12-01), Liu et al.
patent: 2005/0044803 (2005-03-01), Siddiqui et al.
patent: 2005/0565378 (2005-03-01), Chen et al.
patent: 2005/0076578 (2005-04-01), Siddiqui et al.
patent: 2005/0076579 (2005-04-01), Siddiqui et al.
patent: 2005/0079718 (2005-04-01), Siddiqui et al.
patent: 2005/0079803 (2005-04-01), Siddiqui et al.
patent: 2005/0145507 (2005-07-01), Sun et al.
patent: 2005/0218010 (2005-10-01), Wang et al.
patent: 0 527 537 (1993-02-01), None
patent: 0 699 782 (1996-03-01), None
patent: 0 811 665 (1997-12-01), None
patent: 0 846 742 (1998-06-01), None
patent: 1 103 346 (2001-05-01), None
patent: 1 167 585 (2002-01-01), None
patent: 1 170 761 (2002-09-01), None
patent: 58-093886 (19

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