Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1999-08-16
2000-11-07
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429806, 20429816, 20429819, 20419815, 2042982, C23C 1435
Patent
active
061431400
ABSTRACT:
The present invention provides a method and apparatus for achieving conformal step coverage in a deposition process. In at least one aspect, a target provides a source of material to be sputtered by a plasma and then ionized by an inductive coil. At least a portion of the electrons provided by the plasma and ionized target material are deflected by a magnetic field established adjacent to the substrate. Under the influence of the attracted electrons, positively charged particles are induced to move in the direction of the electrons. The magnetic field may be provided by one or more magnets located internally or externally to the processing chamber and which can be rotated to ensure uniform deposition of the electrons and ions on the device features.
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Gogh James van
Gopalraja Praburam
Miller Keith
Wang Wei
Applied Materials Inc.
Chacko-Davis Daborah
Nguyen Nam
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