Method and apparatus to confine plasma and to enhance flow...

Details Method and apparatus to confine plasma and to enhance flow... Method and apparatus to confine plasma and to enhance flow...

2006-05-03

2009-11-17

Hassanzadeh, Parviz (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345510, C156S345520, C156S345530, C156S345540, C156S345550, C156S915000, C118S728000, C118S729000, C118S730000

Reexamination Certificate

active

07618516

ABSTRACT:
The embodiments of the present invention generally relate to annular ring used in a plasma processing chamber. In one embodiment, the annular ring includes an inner wall, an upper outer wall, a lower outer wall, a step defined between the upper and lower outer wall, a top surface and a bottom wall. The step is formed upward and outward from the lower outer wall and inward and downward from the upper outer wall. The annular ring may be fabricated from a conductive material, such as silicon carbide and aluminum.

REFERENCES:
patent: 5413673 (1995-05-01), Fujimoto
patent: 5534751 (1996-07-01), Lenz et al.
patent: 5556500 (1996-09-01), Hasegawa et al.
patent: 5639334 (1997-06-01), Canale et al.
patent: 5685914 (1997-11-01), Hills et al.
patent: 5919332 (1999-07-01), Koshiishi et al.
patent: 6048403 (2000-04-01), Deaton et al.
patent: 6159299 (2000-12-01), Koai et al.
patent: 6257168 (2001-07-01), Ni et al.
patent: 6284093 (2001-09-01), Ke et al.
patent: 6528751 (2003-03-01), Hoffman et al.
patent: 6706138 (2004-03-01), Barnes et al.
patent: 6716762 (2004-04-01), Lenz
patent: 6744212 (2004-06-01), Fischer et al.
patent: 6838635 (2005-01-01), Hoffman et al.
patent: 6853141 (2005-02-01), Hoffman et al.
patent: 6900596 (2005-05-01), Yang et al.
patent: 7001482 (2006-02-01), Landis et al.
patent: 7094315 (2006-08-01), Chen et al.
patent: 7141757 (2006-11-01), Hoffman et al.
patent: 7252738 (2007-08-01), Tong et al.
patent: 2003/0013315 (2003-01-01), Park et al.
patent: 2003/0029859 (2003-02-01), Knoot et al.
patent: 2004/0159287 (2004-08-01), Hoffman et al.
patent: 2004/0206309 (2004-10-01), Bera et al.
patent: 2004/0261712 (2004-12-01), Hayashi et al.
patent: 2005/0061447 (2005-03-01), Kim et al.
patent: 2005/0103442 (2005-05-01), Chen et al.
European Search Report dated May 26, 2006 for EP Application No. 06001700.1.
Office Action Dated Jun. 5, 2007, U.S. Appl. No. 11/046,135.
European Search Report dated May 26, 2006 for EP Application No. 06001700.1.
Prosecution history of, U.S. Appl. No. 11/046,135, filed May 11, 2009.
Prosecution history of, U.S. Appl. No. 11/531,479, filed May 11, 2009.
European Search Report dated May 26, 2006 for EP Application No. 06001700.1.

Affiliated with

Also associated with

Rating

Method and apparatus to confine plasma and to enhance flow... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus to confine plasma and to enhance flow..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus to confine plasma and to enhance flow... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4099255